Speaker
Description
The Cold Sintering Process (CSP) is an innovative consolidation technique enabling densification at low temperatures (below 300 °C) through the combined action of uniaxial pressure and a transient liquid phase. Unlike conventional sintering, CSP relies on solution mediated mass transport, making it particularly suitable for materials such as amorphous silica (SiO₂), which usually require much higher temperatures for densification.
Recent studies report relative densities of 70–80% for cold sintered silica-based materials prepared via Strober method, while maintaining the amorphous structure. This is achieved by mixing silica with a small amount of water or a dilute alkaline solution (NaOH), thanks to the low processing temperature. However, preparing amorphous silica under acidic catalysis significantly alters the underlying chemistry, leading to the formation of not only SiO₂ and SiOH functions, but also Si(OH)₂. This modification enhances densification activation factors, both through in-situ water generation from the elimination of OH groups detected by protonic conductivity with impedance spectroscopy and by achieving nearly 98% densification down to room temperature.
These results highlight the potential of CSP as a low energy, scalable processing route for silica-based ceramics and composites prepared in acidic conditions, opening new perspectives for the development of advanced and functional hybrid and composite materials with reduced environmental impact.
| Professional Status of the Speaker | Doctoral or Master Student |
|---|---|
| Invitation letter for visa | No |
| Interest in submitting a paper in a special issue of | Advanced Engineering Materials (Wiley) |
